Products 레이저 미세가공 서비스

Polymer

PET Film

Wavelength : 355nm

PET Film

Wavelength : 355nm

FTO Release (FTO on glass)

Wavelength : 355nm

Polyimide Film

Wavelength : 532nm

Polyimide Film Cutting

Wavelength : 355nm

ITO Scribing (Including Ag)

Wavelength : 355nm

Hole Drilling

Wavelength : 355nm

Thickness : 2.8nm

Polaroid Film Patterning

Wavelength : 355nm

IRO Scribing (Ag Including)

Wavelength : 355nm

PET Film

Wavelength : 10.6µm

PET Easy Cut

Wavelength : 355nm

ITO Patterning (on the PET film)

Wavelength : 355nm

Wafer (Ceramics)

Drilling of Si-Wafer

Wavelength : 1064nm

Pulse energy :

Rep rate : 10kHz

Si Wafer Round Cutting

Wavelength : 532nm

Thickness : 520μm

Edge Isolation of Si Solarcell

Wavelength : 1064nm

Pulse energy :

Rep rate : 500kHz

Si Wafer Pattern Cutting

Wavelength : 532nm

Removal of TCO on CIGS + Mo Glass

Wavelength : 1064nm

Removal of CIGS on Mo+Glass

Wavelength : 1064nm

Pulse energy :

Rep rate : 500kHz

Silicone Sheet Hole Drilling

Wavelength : 355nm

Si Wafer Pattern Cutting

Wavelength : 532nm

Si Wafer Pattern Cutting

Wavelength : 532nm

Si wafer Drilling

Wavelength : 532nm

Si Wafer Align Key Marking

Wavelength : 355nm

Ceramics

AIN Wafer Hole Drilling

Wavelength : 355nm

Ceramic Hole

Wavelength : 10.6μm

Ceramic Pattern Cutting

Wavelength : 532nm

Metal

Au Pad Full Scribing

Wavelength : 355nm

Copper Foil Hole Drilling

Wavelength : 532nm

Back Electrode Film Ablation (ZnO on the Glass)

Wavelength : 355nm

Ag Nano Wire Thin-film Scribing

Wavelength : 1064nm

Cu Hole Drilling

Wavelength : 355nm

Thickness : 0.1mm

SUS Hole Drilling

Wavelength : 355nm

Thickness : 0.1mm

Alumina Tube Hole Drilling

Wavelength : 10.6μm

Metal Film Patterning

Wavelength : 355nm

SUS304 Hole Drilling

Wavelength : 355nm

Aluminium Through Line Patterning

Wavelength : 532nm

Metal Oxide Film Ablation

Wavelength : 532nm

Si Wafer Metal Layer Ablation

Wavelength : 355nm

Transparent Materials & Etc.

Quartz Micro-Hole Drilling (Cross-Section)

Wavelength : 355nm

Sapphire Micro-Hole Drilling

Wavelength : 355nm

Thickness : 420μm

Soda-Lime Glass Hole Scribing (Via Hole)

Wavelength : 355nm

Quartz Hole Patterning (Via Hole)

Wavelength : 355nm

Superconductor GdBCO Thin Film Scribing (Cross-Section)

Wavelength : 355nm

Superconductor GdBCO Thin Film Hole Drilling (Through Hole)

Wavelength : 355nm

Quartz Scribing

Wavelength : 10.6μm

Flexible Gorilla Glass Cutting

Wavelength : 355nm

Slide Glass Cutting

Wavelength : 355nm

Glass & Medical

High precision glass drilling
High precision glass drilling
Stainless steel stent cutting
ITO Glass Top side Results (Repetition Rate 500 kHz) Top hat beam with pi shaper results
ITO Glass Top side Results (Repetition Rate 500 kHz) Top hat beam with pi shaper results
ITO Glass Top side Results (Repetition Rate 500 kHz) Top hat beam with pi shaper results
ITO Glass Top side Results (Repetition Rate 300 kHz) Top hat beam with pi shaper results:
ITO Glass Top side Results (Repetition Rate 300 kHz) Top hat beam with pi shaper results:

Pipe 가공 가능 Jig 구축

대면적 CO₂

Epoxy Resin Patterning

Thickness : 355nm

기타

Graphene Cutting

Wavelength : 355nm

Carbon Disk Hole Drilling (100% Carbon)

Wavelength : 355nm