Products 레이저 미세가공 서비스

Polymer

PET Film

Wavelength : 355nm

PET Film

Wavelength : 355nm

FTO Release (FTO on glass)

Wavelength : 355nm

Polyimide Film

Wavelength : 532nm

Polyimide Film Cutting

Wavelength : 355nm

ITO Scribing (Including Ag)

Wavelength : 355nm

Hole Drilling

Wavelength : 355nm

Thickness : 2.8nm

Polaroid Film Patterning

Wavelength : 355nm

IRO Scribing (Ag Including)

Wavelength : 355nm

PET Film

Wavelength : 10.6µm

PET Easy Cut

Wavelength : 355nm

ITO Patterning (on the PET film)

Wavelength : 355nm

PI Film Circle Cutting

Wavelength : 355nm

Wafer

Drilling of Si-Wafer

Wavelength : 1064nm

Pulse energy :

Rep rate : 10kHz

Si Wafer Round Cutting

Wavelength : 532nm

Thickness : 520μm

Edge Isolation of Si Solarcell

Wavelength : 1064nm

Pulse energy :

Rep rate : 500kHz

Si Wafer Pattern Cutting

Wavelength : 532nm

Removal of TCO on CIGS + Mo Glass

Wavelength : 1064nm

Removal of CIGS on Mo+Glass

Wavelength : 1064nm

Pulse energy :

Rep rate : 500kHz

Silicone Sheet Hole Drilling

Wavelength : 355nm

Si Wafer Pattern Cutting

Wavelength : 532nm

Si Wafer Pattern Cutting

Wavelength : 532nm

Si wafer Drilling

Wavelength : 532nm

Si Wafer Align Key Marking

Wavelength : 355nm

Si Wafer Circle Cutting

Wavelength : 355nm

Thickness : 700μm

Ceramics

AIN Wafer Hole Drilling

Wavelength : 355nm

Ceramic Hole

Wavelength : 10.6μm

Ceramic Pattern Cutting

Wavelength : 532nm

Alumina Via Hole(70μm)

Wavelength : 1064nm

Thickness : 80μm

Ceramic Pattern cutting

Wavelength : 355nm

Thickness : 80μm

Metal

Au Pad Full Scribing

Wavelength : 355nm

Copper Foil Hole Drilling

Wavelength : 532nm

Back Electrode Film Ablation (ZnO on the Glass)

Wavelength : 355nm

Ag Nano Wire Thin-film Scribing

Wavelength : 1064nm

Cu Hole Drilling

Wavelength : 355nm

Thickness : 0.1mm

SUS Hole Drilling

Wavelength : 355nm

Thickness : 0.1mm

Alumina Tube Hole Drilling

Wavelength : 10.6μm

Metal Film Patterning

Wavelength : 355nm

SUS304 Hole Drilling

Wavelength : 355nm

Aluminium Through Line Patterning

Wavelength : 532nm

Metal Oxide Film Ablation

Wavelength : 532nm

Si Wafer Metal Layer Ablation

Wavelength : 355nm

Transparent Materials & Etc.

Quartz Micro-Hole Drilling (Cross-Section)

Wavelength : 355nm

Sapphire Micro-Hole Drilling

Wavelength : 355nm

Thickness : 420μm

Soda-Lime Glass Hole Scribing (Via Hole)

Wavelength : 355nm

Quartz Hole Patterning (Via Hole)

Wavelength : 355nm

Superconductor GdBCO Thin Film Scribing (Cross-Section)

Wavelength : 355nm

Superconductor GdBCO Thin Film Hole Drilling (Through Hole)

Wavelength : 355nm

Quartz Scribing

Wavelength : 10.6μm

Flexible Gorilla Glass Cutting

Wavelength : 355nm

Slide Glass Cutting

Wavelength : 355nm

Glass & Medical

Borosilicate Glass 3.3(Dia 6", 웨이퍼)

Thickness: 1mm

Laser : Femto seconds 1030nm

High precision glass drilling
High precision glass drilling
Stainless steel stent cutting
ITO Glass Top side Results

Wavelengh : 532nm

Top hat beam with pi shaper results

Borosilicate Glass(Bessel beam)

Wavelengh : 1030nm

Thickness : 1mm

Borosilicate Glass(Bessel beam)

Wavelengh : 1030nm

Thickness : 1mm

Pipe 가공 가능 Jig 구축

대면적 CO₂

Epoxy Resin Patterning

Thickness : 355nm

기타

Graphene Cutting

Wavelength : 355nm

Carbon Disk Hole Drilling (100% Carbon)

Wavelength : 355nm